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Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Authors:
ORCiD logo; ORCiD logo;
Publication Date:
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1484836
Grant/Contract Number:  
NA-0003525
Resource Type:
Journal Article: Published Article
Journal Name:
Journal of the Electrochemical Society
Additional Journal Information:
Journal Name: Journal of the Electrochemical Society Journal Volume: 166 Journal Issue: 1; Journal ID: ISSN 0013-4651
Publisher:
The Electrochemical Society
Country of Publication:
United States
Language:
English

Citation Formats

Rao, Z., Hearne, S. J., and Chason, E. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni. United States: N. p., 2018. Web. doi:10.1149/2.0261901jes.
Rao, Z., Hearne, S. J., & Chason, E. The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni. United States. doi:10.1149/2.0261901jes.
Rao, Z., Hearne, S. J., and Chason, E. Thu . "The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni". United States. doi:10.1149/2.0261901jes.
@article{osti_1484836,
title = {The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni},
author = {Rao, Z. and Hearne, S. J. and Chason, E.},
abstractNote = {},
doi = {10.1149/2.0261901jes},
journal = {Journal of the Electrochemical Society},
number = 1,
volume = 166,
place = {United States},
year = {Thu Dec 06 00:00:00 EST 2018},
month = {Thu Dec 06 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1149/2.0261901jes

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Works referenced in this record:

Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002