The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Rao, Z.; Hearne, S. J.; Chason, E.

doi:10.1149/2.0261901jes

Title: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni

Journal Article · Thu Dec 06 00:00:00 EST 2018 · Journal of the Electrochemical Society

DOI:https://doi.org/10.1149/2.0261901jes· OSTI ID:1484836

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; Chason, E.

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Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA-0003525

OSTI ID:: 1484836

Journal Information:: Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Vol. 166 Journal Issue: 1; ISSN 0013-4651

Publisher:: The Electrochemical SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 10 works

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References (28)

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