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Title: An Improved Design and Versatile New Lamination Fabrication Method for Twin Electrode Thin Layer Cells Utilizing Track-Etch Membranes

Authors:
 [1];  [2];  [2];  [1]
  1. Novel Devices Laboratory, School of Electronics and Computing Systems, University of Cincinnati, Cincinnati, Ohio 45221 USA
  2. ALine, Inc., Accelerated Microfluidic Development, Rancho Dominguez, California 90220 USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1481932
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Electroanalysis
Additional Journal Information:
Journal Name: Electroanalysis; Journal ID: ISSN 1040-0397
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Hauke, Adam, Ehrlich, Said, Levine, Leanna, and Heikenfeld, Jason. An Improved Design and Versatile New Lamination Fabrication Method for Twin Electrode Thin Layer Cells Utilizing Track-Etch Membranes. Germany: N. p., 2018. Web. doi:10.1002/elan.201800539.
Hauke, Adam, Ehrlich, Said, Levine, Leanna, & Heikenfeld, Jason. An Improved Design and Versatile New Lamination Fabrication Method for Twin Electrode Thin Layer Cells Utilizing Track-Etch Membranes. Germany. doi:10.1002/elan.201800539.
Hauke, Adam, Ehrlich, Said, Levine, Leanna, and Heikenfeld, Jason. Tue . "An Improved Design and Versatile New Lamination Fabrication Method for Twin Electrode Thin Layer Cells Utilizing Track-Etch Membranes". Germany. doi:10.1002/elan.201800539.
@article{osti_1481932,
title = {An Improved Design and Versatile New Lamination Fabrication Method for Twin Electrode Thin Layer Cells Utilizing Track-Etch Membranes},
author = {Hauke, Adam and Ehrlich, Said and Levine, Leanna and Heikenfeld, Jason},
abstractNote = {},
doi = {10.1002/elan.201800539},
journal = {Electroanalysis},
number = ,
volume = ,
place = {Germany},
year = {Tue Nov 13 00:00:00 EST 2018},
month = {Tue Nov 13 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on November 13, 2019
Publisher's Accepted Manuscript

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