Temperature dependent thermoelectric properties of cuprous delafossite oxides

Feng, Yining; Elquist, Aline; Zhang, Yuepeng; Gao, Kaizhong; Ferguson, Ian; Tzempelikos, Athanasios; Lu, Na

doi:10.1016/j.compositesb.2018.08.070

Title: Temperature dependent thermoelectric properties of cuprous delafossite oxides

Journal Article · Wed Aug 22 00:00:00 EDT 2018 · Composites Part B: Engineering

DOI:https://doi.org/10.1016/j.compositesb.2018.08.070· OSTI ID:1481172

^[1]; Elquist, Aline ^[1]; Zhang, Yuepeng ^[2]; Gao, Kaizhong ^[2]; Ferguson, Ian ^[3];

^[1]; Lu, Na ^[1]

Purdue Univ., West Lafayette, IN (United States)
Argonne National Lab. (ANL), Lemont, IL (United States)
Missouri Univ. of Science and Technology, Rolla, MO (United States)

The use of nanostructured delafossite oxides in thermoelectric (TE) applications has attracted a great interest due to their high performance and long-term stability at elevated temperatures. Cuprous delafossites, CuMO₂ (M=Al, Cr, Fe, Ga, Mn), compared to conventional TE materials, such as Bi₂Te₃, PbTe and SiGe, are non-toxic and more earth abundant. In particular, CuAlO₂ compound shows a great potential for high performance thermoelectric materials. In this work, a systematic study of temperature dependent TE properties of cuprous delafossite materials, CuAlO₂, is reported. The optimization of the TE properties has been realized by controlling nanostructure size around 80 nm CuAlO₂ powder was prepared using a solid-state synthesis method at ~1373 K in nitrogen/air atmosphere. The nanostructure size was controlled by a high energy ball milling process. Reducing the particle size of nanostructured bulk materials decouples interdependent electron and phonon transport and results in a lattice thermal conductivity decrease without deteriorating electrical conductivity. As a result, the high effective mass plays a dominant role in the high Seebeck coefficient and low electrical conductivity. The power factor reached ~0.78×10^-5 W/mK² at 780 K. Temperature dependent TE properties, including Seebeck coefficient, electrical conductivity, and thermal conductivity are analyzed. The processing-structure-property correlation of these materials are discussed.

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Research Organization:: Argonne National Lab. (ANL), Argonne, IL (United States)

Sponsoring Organization:: Purdue University; National Science Foundation (NSF); USDOE

Grant/Contract Number:: AC02-06CH11357

OSTI ID:: 1481172

Journal Information:: Composites Part B: Engineering, Vol. 156, Issue C; ISSN 1359-8368

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 12 works

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