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Title: High voltage power chip module

Abstract

A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.

Inventors:
;
Publication Date:
Research Org.:
Cree, Inc., Durham, NC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1479658
Patent Number(s):
10,080,301
Application Number:
14/516,700
Assignee:
Cree, Inc. (Durham, NC) CHO
DOE Contract Number:  
SC0008239
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Oct 17
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Passmore, Brandon, and Cole, Zachary. High voltage power chip module. United States: N. p., 2018. Web.
Passmore, Brandon, & Cole, Zachary. High voltage power chip module. United States.
Passmore, Brandon, and Cole, Zachary. Tue . "High voltage power chip module". United States. doi:. https://www.osti.gov/servlets/purl/1479658.
@article{osti_1479658,
title = {High voltage power chip module},
author = {Passmore, Brandon and Cole, Zachary},
abstractNote = {A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 18 00:00:00 EDT 2018},
month = {Tue Sep 18 00:00:00 EDT 2018}
}

Patent:

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