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Title: 50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications

Abstract

The traditional heatsink design technologies for forced air-cooling and power semiconductors with low junction temperatures have constrained the converters to be designed with massive heatsinks. The low power losses of WBG device technology and higher junction temperature operation over a wide operating range of power have not been fully utilized with liquid-cooled systems. The other major limitation has also been the traditional power module packaging “stack” approach with baseplate. This paper presents a novel power stage design which involves 1.7 kV silicon carbide (SiC) MOSFETs, a heatsink design with Genetic Algorithm (GA) and built using 3D printing technology, and a novel integrated modular power module for high power density. The air-cooled module assembly has a SiC MOSFET phase leg module with split high-side and low-side switches and a gate driver with cross-talk and short circuit protection functions. The heatsink design was modeled using a co-simulation environment with finite element analysis software and GA in MATLAB and COMSOL. The proposed concepts were verified and validated through experiments at each stage of development. The power stage was evaluated at 800V, 900 V, and 1kV for 20 kHz switching frequency and 50-kW load. The experimental results show that the CEC efficiency is 98.4more » %. In addition to the efficiency, a power density of 75 W/in 3 was also achieved.« less

Authors:
ORCiD logo [1]; ORCiD logo [1]; ORCiD logo [1]; ORCiD logo [1]; ORCiD logo [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1474663
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - San Antonio, Texas, United States of America - 3/4/2018 5:00:00 AM-3/8/2018 5:00:00 AM
Country of Publication:
United States
Language:
English

Citation Formats

Chinthavali, Madhu Sudhan, Wang, Zhiqiang, Campbell, Steven L., Wu, Tong, and Ozpineci, Burak. 50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications. United States: N. p., 2018. Web. doi:10.1109/APEC.2018.8340999.
Chinthavali, Madhu Sudhan, Wang, Zhiqiang, Campbell, Steven L., Wu, Tong, & Ozpineci, Burak. 50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications. United States. doi:10.1109/APEC.2018.8340999.
Chinthavali, Madhu Sudhan, Wang, Zhiqiang, Campbell, Steven L., Wu, Tong, and Ozpineci, Burak. Thu . "50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications". United States. doi:10.1109/APEC.2018.8340999. https://www.osti.gov/servlets/purl/1474663.
@article{osti_1474663,
title = {50-kW 1kV DC bus air-cooled inverter with 1.7 kV SiC MOSFETs and 3D-printed novel power module packaging structure for grid applications},
author = {Chinthavali, Madhu Sudhan and Wang, Zhiqiang and Campbell, Steven L. and Wu, Tong and Ozpineci, Burak},
abstractNote = {The traditional heatsink design technologies for forced air-cooling and power semiconductors with low junction temperatures have constrained the converters to be designed with massive heatsinks. The low power losses of WBG device technology and higher junction temperature operation over a wide operating range of power have not been fully utilized with liquid-cooled systems. The other major limitation has also been the traditional power module packaging “stack” approach with baseplate. This paper presents a novel power stage design which involves 1.7 kV silicon carbide (SiC) MOSFETs, a heatsink design with Genetic Algorithm (GA) and built using 3D printing technology, and a novel integrated modular power module for high power density. The air-cooled module assembly has a SiC MOSFET phase leg module with split high-side and low-side switches and a gate driver with cross-talk and short circuit protection functions. The heatsink design was modeled using a co-simulation environment with finite element analysis software and GA in MATLAB and COMSOL. The proposed concepts were verified and validated through experiments at each stage of development. The power stage was evaluated at 800V, 900 V, and 1kV for 20 kHz switching frequency and 50-kW load. The experimental results show that the CEC efficiency is 98.4 %. In addition to the efficiency, a power density of 75 W/in 3 was also achieved.},
doi = {10.1109/APEC.2018.8340999},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {3}
}

Conference:
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