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Title: Cryogenic and high temperature operation of Al{sub 0.52}In{sub 0.48}P/In{sub 0.2}Ga{sup 0.8}As high electron mobility transistors

Journal Article · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena
DOI:https://doi.org/10.1116/1.586903· OSTI ID:147058
 [1];  [2]
  1. AT & T Bell Lab., Murray Hill, NJ (United States)
  2. National Central Univ., Chung-Li (Taiwan, Province of China)

The cryogenic and high temperature characterization of Al{sub 0.52}In{sub 0.48}P/In{sub 0.2}Ga{sub 0.8}As high electron mobility transistors (HEMTs) with 1 {mu}m-long gates, grown by gas-source molecular-beam epitaxy is being reported. Bias-stress measurements at 77 K in the dark showed only 18 mV threshold voltage shift, confirming that trapping effects are negligible in this material system. Successful operation of these HEMTs at temperatures up to 300 {degrees}C has been achieved. These results suggest that AlInP/InGaAs HEMTs have potential for cryogenic and high temperature applications. 9 refs., 4 figs., 1 tab.

OSTI ID:
147058
Report Number(s):
CONF-9210296-; ISSN 0734-211X; TRN: 95:007540-0066
Journal Information:
Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena, Vol. 11, Issue 3; Conference: North American conference on molecular beam epitaxy, Ontario (Canada), 12-14 Oct 1992; Other Information: PBD: May-Jun 1993
Country of Publication:
United States
Language:
English