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Title: System and method for neural interface with modular active electronics

Abstract

A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1459550
Patent Number(s):
9,999,363
Application Number:
14/684,673
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA) LLNL
DOE Contract Number:
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Apr 13
Country of Publication:
United States
Language:
English

Citation Formats

Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, and Tooker, Angela C.. System and method for neural interface with modular active electronics. United States: N. p., 2018. Web.
Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, & Tooker, Angela C.. System and method for neural interface with modular active electronics. United States.
Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, and Tooker, Angela C.. Tue . "System and method for neural interface with modular active electronics". United States. doi:. https://www.osti.gov/servlets/purl/1459550.
@article{osti_1459550,
title = {System and method for neural interface with modular active electronics},
author = {Shah, Kedar G. and Felix, Sarah H. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C.},
abstractNote = {A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 19 00:00:00 EDT 2018},
month = {Tue Jun 19 00:00:00 EDT 2018}
}

Patent:

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