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Title: Highly Stable Battery Pack via Insulated, Reinforced, Buckling-Enabled Interconnect Array

Authors:
 [1];  [1];  [1];  [1];  [1];  [1];  [1];  [1];  [1]; ORCiD logo [1]
  1. Department of Nanoengineering, University of California San Diego, 9500 Gilman Dr La Jolla CA 92093 USA
Publication Date:
Sponsoring Org.:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
OSTI Identifier:
1458831
Grant/Contract Number:  
AR0000535
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Small
Additional Journal Information:
Journal Name: Small; Journal ID: ISSN 1613-6810
Publisher:
Wiley Blackwell (John Wiley & Sons)
Country of Publication:
Germany
Language:
English

Citation Formats

Yin, Lu, Seo, Joon Kyo, Kurniawan, Jonas, Kumar, Rajan, Lv, Jian, Xie, Lingye, Liu, Xinyu, Xu, Sheng, Meng, Ying S., and Wang, Joseph. Highly Stable Battery Pack via Insulated, Reinforced, Buckling-Enabled Interconnect Array. Germany: N. p., 2018. Web. doi:10.1002/smll.201800938.
Yin, Lu, Seo, Joon Kyo, Kurniawan, Jonas, Kumar, Rajan, Lv, Jian, Xie, Lingye, Liu, Xinyu, Xu, Sheng, Meng, Ying S., & Wang, Joseph. Highly Stable Battery Pack via Insulated, Reinforced, Buckling-Enabled Interconnect Array. Germany. doi:10.1002/smll.201800938.
Yin, Lu, Seo, Joon Kyo, Kurniawan, Jonas, Kumar, Rajan, Lv, Jian, Xie, Lingye, Liu, Xinyu, Xu, Sheng, Meng, Ying S., and Wang, Joseph. Tue . "Highly Stable Battery Pack via Insulated, Reinforced, Buckling-Enabled Interconnect Array". Germany. doi:10.1002/smll.201800938.
@article{osti_1458831,
title = {Highly Stable Battery Pack via Insulated, Reinforced, Buckling-Enabled Interconnect Array},
author = {Yin, Lu and Seo, Joon Kyo and Kurniawan, Jonas and Kumar, Rajan and Lv, Jian and Xie, Lingye and Liu, Xinyu and Xu, Sheng and Meng, Ying S. and Wang, Joseph},
abstractNote = {},
doi = {10.1002/smll.201800938},
journal = {Small},
number = ,
volume = ,
place = {Germany},
year = {Tue Jul 03 00:00:00 EDT 2018},
month = {Tue Jul 03 00:00:00 EDT 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on July 3, 2019
Publisher's Accepted Manuscript

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Works referenced in this record:

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