Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder
- Carnegie Mellon Univ., Pittsburgh, PA (United States)
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term 'supersolder' to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional solders and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.
- Research Organization:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Organization:
- U.S. Department of Defense (DOD), Defense Advanced Research Projects Agency (DARPA); USDOE
- Grant/Contract Number:
- AC36-08GO28308
- OSTI ID:
- 1456864
- Report Number(s):
- NREL/JA-5400-71577
- Journal Information:
- Nano Letters, Vol. 18, Issue 6; ISSN 1530-6984
- Publisher:
- American Chemical SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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