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Title: Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects

Authors:
 [1];  [1];  [1];  [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1456805
Report Number(s):
ORNL/TM-2018/1
DOE Contract Number:
AC05-00OR22725
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English

Citation Formats

Wereszczak, Andrew A., Modugno, Max C., Chen, Branndon R., and Oistad, Brian A.. Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects. United States: N. p., 2018. Web. doi:10.2172/1456805.
Wereszczak, Andrew A., Modugno, Max C., Chen, Branndon R., & Oistad, Brian A.. Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects. United States. doi:10.2172/1456805.
Wereszczak, Andrew A., Modugno, Max C., Chen, Branndon R., and Oistad, Brian A.. Fri . "Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects". United States. doi:10.2172/1456805. https://www.osti.gov/servlets/purl/1456805.
@article{osti_1456805,
title = {Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects},
author = {Wereszczak, Andrew A. and Modugno, Max C. and Chen, Branndon R. and Oistad, Brian A.},
abstractNote = {},
doi = {10.2172/1456805},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jun 01 00:00:00 EDT 2018},
month = {Fri Jun 01 00:00:00 EDT 2018}
}

Technical Report:

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