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Title: Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

Abstract

Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts. Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.

Authors:
 [1];  [1];  [1]
  1. Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Publication Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
OSTI Identifier:
1456242
Report Number(s):
FERMILAB-PUB-18-097-DI-TD
Journal ID: ISSN 0011-2275; 1678622
Grant/Contract Number:
AC02-07CH11359
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Cryogenics
Additional Journal Information:
Journal Volume: 93; Journal Issue: C; Journal ID: ISSN 0011-2275
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
43 PARTICLE ACCELERATORS

Citation Formats

Dhuley, R. C., Geelhoed, M. I., and Thangaraj, J. C. T.. Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures. United States: N. p., 2018. Web. doi:10.1016/j.cryogenics.2018.06.003.
Dhuley, R. C., Geelhoed, M. I., & Thangaraj, J. C. T.. Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures. United States. doi:10.1016/j.cryogenics.2018.06.003.
Dhuley, R. C., Geelhoed, M. I., and Thangaraj, J. C. T.. Fri . "Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures". United States. doi:10.1016/j.cryogenics.2018.06.003.
@article{osti_1456242,
title = {Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures},
author = {Dhuley, R. C. and Geelhoed, M. I. and Thangaraj, J. C. T.},
abstractNote = {Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts. Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.},
doi = {10.1016/j.cryogenics.2018.06.003},
journal = {Cryogenics},
number = C,
volume = 93,
place = {United States},
year = {Fri Jun 15 00:00:00 EDT 2018},
month = {Fri Jun 15 00:00:00 EDT 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on June 15, 2019
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