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High thermal conductivity materials for thermal management applications

Patent ·
OSTI ID:1452907
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
Research Organization:
The United States of America, as represented by the Secretary of the Navy, Washington, DC (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
SC0001299; SC0001299
Assignee:
The United States of America, as represented by the Secretary of the Navy (Washington, DC)
Patent Number(s):
9,986,663
Application Number:
14/763,993
OSTI ID:
1452907
Country of Publication:
United States
Language:
English

References (5)

Thermal conductivity of GaN crystals grown by high pressure method journal November 2003
High Lattice Thermal Conductivity Solids book January 2006
First-Principles Determination of Ultrahigh Thermal Conductivity of Boron Arsenide: A Competitor for Diamond? journal July 2013
Nonmetallic crystals with high thermal conductivity journal January 1973
Thermal conductivity of isotopically enriched 28Si: revisited journal August 2004

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