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Title: High thermal conductivity materials for thermal management applications

Abstract

High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.

Inventors:
; ;
Publication Date:
Research Org.:
The United States of America, as represented by the Secretary of the Navy, Washington, DC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1452907
Patent Number(s):
9,986,663
Application Number:
14/763,993
Assignee:
The United States of America, as represented by the Secretary of the Navy (Washington, DC)
DOE Contract Number:  
FG02-09ER46577; SC0001299
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Jan 29
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States: N. p., 2018. Web.
Broido, David A., Reinecke, Thomas L., & Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States.
Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. Tue . "High thermal conductivity materials for thermal management applications". United States. https://www.osti.gov/servlets/purl/1452907.
@article{osti_1452907,
title = {High thermal conductivity materials for thermal management applications},
author = {Broido, David A. and Reinecke, Thomas L. and Lindsay, Lucas R.},
abstractNote = {High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}

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Works referenced in this record:

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