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Title: Spreading devices into a 2-D module layout

Abstract

An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440749
Patent Number(s):
9,972,736
Application Number:
14/205,839
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL-A
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Mar 12
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats

Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, and Nelson, Jeffrey S. Spreading devices into a 2-D module layout. United States: N. p., 2018. Web.
Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, & Nelson, Jeffrey S. Spreading devices into a 2-D module layout. United States.
Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, and Nelson, Jeffrey S. Tue . "Spreading devices into a 2-D module layout". United States. doi:. https://www.osti.gov/servlets/purl/1440749.
@article{osti_1440749,
title = {Spreading devices into a 2-D module layout},
author = {Koplow, Jeffrey P. and Gupta, Vipin P. and Nielson, Gregory N. and Okandan, Murat and Cruz-Campa, Jose Luis and Nelson, Jeffrey S.},
abstractNote = {An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 15 00:00:00 EDT 2018},
month = {Tue May 15 00:00:00 EDT 2018}
}

Patent:

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