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Title: Provisioning cooling elements for chillerless data centers

Abstract

Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Inventors:
;
Publication Date:
Research Org.:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440740
Patent Number(s):
9,974,213
Application Number:
14/715,944
Assignee:
International Business Machines Corporation (Armonk, NY) DOEEE
DOE Contract Number:
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 May 19
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chainer, Timothy J., and Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States: N. p., 2018. Web.
Chainer, Timothy J., & Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States.
Chainer, Timothy J., and Parida, Pritish R. Tue . "Provisioning cooling elements for chillerless data centers". United States. doi:. https://www.osti.gov/servlets/purl/1440740.
@article{osti_1440740,
title = {Provisioning cooling elements for chillerless data centers},
author = {Chainer, Timothy J. and Parida, Pritish R.},
abstractNote = {Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 15 00:00:00 EDT 2018},
month = {Tue May 15 00:00:00 EDT 2018}
}

Patent:

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