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Title: Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials

Abstract

The concept of twin-limited microstructures has been explored in the literature as a crystallographically constrained grain boundary network connected via only coincident site lattice (CSL) boundaries. The advent of orientation imaging has made classification of twin-related domains (TRD) or any other orientation cluster experimentally accessible in 2D using EBSD. With the emergence of 3D orientation mapping, a comparison of TRDs in measured 3D microstructures is performed in this paper and compared against their 2D counterparts. The TRD analysis is performed on a conventionally processed (CP) and a grain boundary engineered (EM) high purity copper sample that have been subjected to successive anneal procedures to promote grain growth. Finally, the EM sample shows extremely large TRDs which begin to approach that of a twin-limited microstructure, while the TRDs in the CP sample remain relatively small and remote.

Authors:
ORCiD logo [1];  [1];  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1438652
Alternate Identifier(s):
OSTI ID: 1323567
Report Number(s):
LLNL-JRNL-674918
Journal ID: ISSN 1359-6454
Grant/Contract Number:
AC52-07NA27344; AC02-06CH11357
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 114; Journal ID: ISSN 1359-6454
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; grain boundary engineering; 3D characterization; TRD; nf-HEDM

Citation Formats

Lind, Jonathan, Li, Shiu Fai, and Kumar, Mukul. Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials. United States: N. p., 2016. Web. doi:10.1016/j.actamat.2016.03.002.
Lind, Jonathan, Li, Shiu Fai, & Kumar, Mukul. Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials. United States. doi:10.1016/j.actamat.2016.03.002.
Lind, Jonathan, Li, Shiu Fai, and Kumar, Mukul. Fri . "Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials". United States. doi:10.1016/j.actamat.2016.03.002. https://www.osti.gov/servlets/purl/1438652.
@article{osti_1438652,
title = {Twin related domains in 3D microstructures of conventionally processed and grain boundary engineered materials},
author = {Lind, Jonathan and Li, Shiu Fai and Kumar, Mukul},
abstractNote = {The concept of twin-limited microstructures has been explored in the literature as a crystallographically constrained grain boundary network connected via only coincident site lattice (CSL) boundaries. The advent of orientation imaging has made classification of twin-related domains (TRD) or any other orientation cluster experimentally accessible in 2D using EBSD. With the emergence of 3D orientation mapping, a comparison of TRDs in measured 3D microstructures is performed in this paper and compared against their 2D counterparts. The TRD analysis is performed on a conventionally processed (CP) and a grain boundary engineered (EM) high purity copper sample that have been subjected to successive anneal procedures to promote grain growth. Finally, the EM sample shows extremely large TRDs which begin to approach that of a twin-limited microstructure, while the TRDs in the CP sample remain relatively small and remote.},
doi = {10.1016/j.actamat.2016.03.002},
journal = {Acta Materialia},
number = ,
volume = 114,
place = {United States},
year = {Fri May 20 00:00:00 EDT 2016},
month = {Fri May 20 00:00:00 EDT 2016}
}

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