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Title: Hot gas path component having cast-in features for near wall cooling

Abstract

A hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface of the substrate defines at least one interior space. At least a portion of the outer surface of the substrate includes a recess formed therein. The recess includes a bottom surface and a groove extending at least partially along the bottom surface of the recess. A cover is disposed within the recess and covers at least a portion of the groove. The groove is configured to channel a cooling fluid therethrough to cool the cover.

Inventors:
; ;
Publication Date:
Research Org.:
General Electric Company, Schenectady, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1434522
Patent Number(s):
9,938,899
Application Number:
14/739,791
Assignee:
General Electric Company (Schenectady, NY) NETL
DOE Contract Number:
FC26-05NT42643
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Jun 15
Country of Publication:
United States
Language:
English

Citation Formats

Miranda, Carlos Miguel, Kottilingam, Srikanth Chandrudu, and Lacy, Benjamin Paul. Hot gas path component having cast-in features for near wall cooling. United States: N. p., 2018. Web.
Miranda, Carlos Miguel, Kottilingam, Srikanth Chandrudu, & Lacy, Benjamin Paul. Hot gas path component having cast-in features for near wall cooling. United States.
Miranda, Carlos Miguel, Kottilingam, Srikanth Chandrudu, and Lacy, Benjamin Paul. Tue . "Hot gas path component having cast-in features for near wall cooling". United States. doi:. https://www.osti.gov/servlets/purl/1434522.
@article{osti_1434522,
title = {Hot gas path component having cast-in features for near wall cooling},
author = {Miranda, Carlos Miguel and Kottilingam, Srikanth Chandrudu and Lacy, Benjamin Paul},
abstractNote = {A hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface of the substrate defines at least one interior space. At least a portion of the outer surface of the substrate includes a recess formed therein. The recess includes a bottom surface and a groove extending at least partially along the bottom surface of the recess. A cover is disposed within the recess and covers at least a portion of the groove. The groove is configured to channel a cooling fluid therethrough to cool the cover.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 10 00:00:00 EDT 2018},
month = {Tue Apr 10 00:00:00 EDT 2018}
}

Patent:

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