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Title: Pin fin compliant heat sink with enhanced flexibility

Patent ·
OSTI ID:1434516

Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894
Assignee:
International Business Machines Corporation, Armonk, NY
Patent Number(s):
9,939,210
Application Number:
14/500,541
OSTI ID:
1434516
Resource Relation:
Patent File Date: 2014 Sep 29
Country of Publication:
United States
Language:
English

References (21)

Restorable backbond for LSI chips using liquid metal coated dendrites patent March 1981
Apparatus for cooling high-density integrated circuit packages patent April 1983
Cooling element for solder bonded semiconductor devices patent April 1984
Flexible finned heat exchanger patent June 1991
Compliant thermal connectors, methods of making the same and assemblies incorporating the same patent July 1997
Flexibly suspended heat exchange head for a DUT patent May 2002
Pin retention for thermal transfer interfaces, and associated methods patent March 2005
Flexible heat exchangers for medical cooling and warming applications patent July 2006
Compliant thermal interface structure with vapor chamber patent September 2007
Compliant thermal interface structure utilizing spring elements patent April 2008
Cooling structure using rigid movable elements patent April 2008
Flexible heat sink patent July 2008
Compliant thermal interface structure utilizing spring elements with fins patent August 2008
Integrated cooling system patent January 2009
Compliant thermal interface structure utilizing spring elements patent June 2009
Cooling structure using rigid movable elements patent June 2009
Integrated circuit package system with a heat sink patent October 2011
Flexible heat sink with lateral compliance patent May 2014
Flexible heat exchangers patent-application March 2005
Apparatus and Methods for Warming and Cooling Bodies patent-application August 2006
Compliant Pin Fin Heat Sink and Methods patent-application August 2013

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