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Title: Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Abstract

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Inventors:
; ; ; ; ; ;
Publication Date:
Research Org.:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1432671
Patent Number(s):
9,936,607
Application Number:
14/564,265
Assignee:
International Business Machines Corporation, Armonk, NY DOEEE
DOE Contract Number:
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Dec 09
Country of Publication:
United States
Language:
English

Citation Formats

Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E.. Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader. United States: N. p., 2018. Web.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., & Steinke, Mark E.. Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader. United States.
Chainer, Timothy J., Graybill, David P., Iyengar, Madhusudan K., Kamath, Vinod, Kochuparambil, Bejoy J., Schmidt, Roger R., and Steinke, Mark E.. Tue . "Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader". United States. doi:. https://www.osti.gov/servlets/purl/1432671.
@article{osti_1432671,
title = {Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader},
author = {Chainer, Timothy J. and Graybill, David P. and Iyengar, Madhusudan K. and Kamath, Vinod and Kochuparambil, Bejoy J. and Schmidt, Roger R. and Steinke, Mark E.},
abstractNote = {Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 03 00:00:00 EDT 2018},
month = {Tue Apr 03 00:00:00 EDT 2018}
}

Patent:

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