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Title: Wittichenite Cu3BiS3: Synthesis and Physical Properties

Abstract

Polycrystalline Cu 3BiS 3 was synthesized and densified using hot pressing in order to investigate the physical properties of this material. Both the thermal conductivity and the Seebeck coefficient of Cu 3BiS 3 are reported for the first time in order to investigate the thermoelectric properties of this material. The ultralow thermal conductivity coupled with the relatively high Seebeck coefficient, 0.17 W/m-K and 540 μV/K at room temperature, respectively, suggest Cu 3BiS 3 may show promise for thermoelectric applications.

Authors:
 [1];  [1];  [2];  [1]
  1. Univ. of South Florida, Tampa, FL (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1427667
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 47; Journal Issue: 4; Journal ID: ISSN 0361-5235
Publisher:
Springer
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wei, Kaya, Hobbis, Dean, Wang, Hsin, and Nolas, George S. Wittichenite Cu3BiS3: Synthesis and Physical Properties. United States: N. p., 2018. Web. doi:10.1007/s11664-017-6053-0.
Wei, Kaya, Hobbis, Dean, Wang, Hsin, & Nolas, George S. Wittichenite Cu3BiS3: Synthesis and Physical Properties. United States. doi:10.1007/s11664-017-6053-0.
Wei, Kaya, Hobbis, Dean, Wang, Hsin, and Nolas, George S. Thu . "Wittichenite Cu3BiS3: Synthesis and Physical Properties". United States. doi:10.1007/s11664-017-6053-0.
@article{osti_1427667,
title = {Wittichenite Cu3BiS3: Synthesis and Physical Properties},
author = {Wei, Kaya and Hobbis, Dean and Wang, Hsin and Nolas, George S.},
abstractNote = {Polycrystalline Cu3BiS3 was synthesized and densified using hot pressing in order to investigate the physical properties of this material. Both the thermal conductivity and the Seebeck coefficient of Cu3BiS3 are reported for the first time in order to investigate the thermoelectric properties of this material. The ultralow thermal conductivity coupled with the relatively high Seebeck coefficient, 0.17 W/m-K and 540 μV/K at room temperature, respectively, suggest Cu3BiS3 may show promise for thermoelectric applications.},
doi = {10.1007/s11664-017-6053-0},
journal = {Journal of Electronic Materials},
number = 4,
volume = 47,
place = {United States},
year = {Thu Jan 18 00:00:00 EST 2018},
month = {Thu Jan 18 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on January 18, 2019
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