Power module assembly with reduced inductance
A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.
- Research Organization:
- GM Global Technology Operations LLC, Detroit, MI (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE-0007285
- Assignee:
- GM Global Technology Operations LLC (Detroit, MI)
- Patent Number(s):
- 9,917,065
- Application Number:
- 15/260,858
- OSTI ID:
- 1425966
- Resource Relation:
- Patent File Date: 2016 Sep 09
- Country of Publication:
- United States
- Language:
- English
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