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Title: Power module assembly with reduced inductance

Abstract

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Inventors:
; ; ;
Publication Date:
Research Org.:
GM Global Technology Operations LLC, Detroit, MI (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1425966
Patent Number(s):
9,917,065
Application Number:
15/260,858
Assignee:
GM Global Technology Operations LLC (Detroit, MI) NETL
DOE Contract Number:  
EE-0007285
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Sep 09
Country of Publication:
United States
Language:
English

Citation Formats

Ward, Terence G., Stancu, Constantin C., Jaksic, Marko, and Mann, Brooks S. Power module assembly with reduced inductance. United States: N. p., 2018. Web.
Ward, Terence G., Stancu, Constantin C., Jaksic, Marko, & Mann, Brooks S. Power module assembly with reduced inductance. United States.
Ward, Terence G., Stancu, Constantin C., Jaksic, Marko, and Mann, Brooks S. Tue . "Power module assembly with reduced inductance". United States. doi:. https://www.osti.gov/servlets/purl/1425966.
@article{osti_1425966,
title = {Power module assembly with reduced inductance},
author = {Ward, Terence G. and Stancu, Constantin C. and Jaksic, Marko and Mann, Brooks S.},
abstractNote = {A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 13 00:00:00 EDT 2018},
month = {Tue Mar 13 00:00:00 EDT 2018}
}

Patent:

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