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Reducing leakage current in semiconductor devices

Patent ·
OSTI ID:1425209
A semiconductor device includes a first region having a first semiconductor material and a second region having a second semiconductor material. The second region is formed over the first region. The semiconductor device also includes a current blocking structure formed in the first region between first and second terminals of the semiconductor device. The current blocking structure is configured to reduce current flow in the first region between the first and second terminals.
Research Organization:
Massachusetts Institute of Technology, Cambridge, MA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AR0000123
Assignee:
Massachusetts Institute of Technology (Cambridge, MA)
Patent Number(s):
9,911,813
Application Number:
14/651,012
OSTI ID:
1425209
Country of Publication:
United States
Language:
English

References (16)

GaN enhancement∕depletion-mode FET logic for mixed signal applications journal January 2005
An insulator-lined silicon substrate-via technology with high aspect ratio journal January 2001
Epitaxial Lateral Overgrowth of GaN journal September 2001
Breakdown Enhancement of AlGaN/GaN HEMTs on 4-in Silicon by Improving the GaN Quality on Thick Buffer Layers journal June 2009
Growth of embedded photonic crystals for GaN-based optoelectronic devices journal July 2009
High-power AlGaN/GaN HEMTs for Ka-band applications journal November 2005
High Breakdown ( >1500 V ) AlGaN/GaN HEMTs by Substrate-Transfer Technology journal September 2010
Origin of etch delay time in Cl2 dry etching of AlGaN/GaN structures journal December 2003
High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on 4 inch Si substrates and the suppression of current collapse conference May 2008
Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher journal January 1999
Gan-on-Silicon Based Technology for RF Cellular and Wimax Infrastructure Applications conference June 2006
Ultrathin gate oxide CMOS on [111] surface-oriented Si substrate journal September 2002
GaN-Based Devices on Si journal December 2002
40-W/mm Double Field-plated GaN HEMTs conference June 2006
High-Breakdown Enhancement-Mode AlGaN/GaN HEMTs with Integrated Slant Field-Plate conference December 2006
Optimization of AlGaN/GaN HEMTs for high frequency operation journal May 2006

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