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Title: Cantilever testing of sintered-silver interconnects

Abstract

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimations of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.

Authors:
ORCiD logo [1];  [2];  [3]; ORCiD logo [2];  [2];  [4];  [5]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
  3. Univ. of Mount Union, Alliance, OH (United States)
  4. Marlow Industries, Inc., Dallas, TX (United States)
  5. General Motors Global Research and Development, Warren, MI (United States)
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1423116
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Journal of Materials Science Materials in Electronics
Additional Journal Information:
Journal Volume: 29; Journal Issue: 2; Journal ID: ISSN 0957-4522
Publisher:
Springer
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Wereszczak, Andrew A., Chen, Branndon R., Jadaan, Osama M., Oistad, Brian A., Modugno, Max C., Sharp, Jeffrey W., and Salvador, James R. Cantilever testing of sintered-silver interconnects. United States: N. p., 2017. Web. doi:10.1007/s10854-017-8063-3.
Wereszczak, Andrew A., Chen, Branndon R., Jadaan, Osama M., Oistad, Brian A., Modugno, Max C., Sharp, Jeffrey W., & Salvador, James R. Cantilever testing of sintered-silver interconnects. United States. doi:10.1007/s10854-017-8063-3.
Wereszczak, Andrew A., Chen, Branndon R., Jadaan, Osama M., Oistad, Brian A., Modugno, Max C., Sharp, Jeffrey W., and Salvador, James R. Thu . "Cantilever testing of sintered-silver interconnects". United States. doi:10.1007/s10854-017-8063-3. https://www.osti.gov/servlets/purl/1423116.
@article{osti_1423116,
title = {Cantilever testing of sintered-silver interconnects},
author = {Wereszczak, Andrew A. and Chen, Branndon R. and Jadaan, Osama M. and Oistad, Brian A. and Modugno, Max C. and Sharp, Jeffrey W. and Salvador, James R.},
abstractNote = {Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimations of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.},
doi = {10.1007/s10854-017-8063-3},
journal = {Journal of Materials Science Materials in Electronics},
number = 2,
volume = 29,
place = {United States},
year = {Thu Oct 19 00:00:00 EDT 2017},
month = {Thu Oct 19 00:00:00 EDT 2017}
}

Journal Article:
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