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Title: Cantilever testing of sintered-silver interconnects

Journal Article · · Journal of Materials Science Materials in Electronics
ORCiD logo [1];  [2];  [3]; ORCiD logo [2];  [2];  [4];  [5]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
  3. Univ. of Mount Union, Alliance, OH (United States)
  4. Marlow Industries, Inc., Dallas, TX (United States)
  5. General Motors Global Research and Development, Warren, MI (United States)
+ Show Author Affiliations

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimations of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1423116
Journal Information:
Journal of Materials Science Materials in Electronics, Vol. 29, Issue 2; ISSN 0957-4522
Publisher:
SpringerCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 2 works
Citation information provided by
Web of Science

References (8)

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Stresses in a deep beam with a central concentrated load: The results of a series of photoelastic tests are presented and a comparison between the theoretical and experimental stress distribution is shown on a number of sections journal June 1961
Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures journal September 2010
Effect of depth span ratio on the behaviour of beams journal June 2014
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? journal January 2014
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material journal October 2014
The Beam Strength of Modern Gear-Tooth Design conference January 1958
Contact Drying of Printed Sinterable-Silver Paste journal December 2017

Cited By (1)

Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects journal October 2018

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36 MATERIALS SCIENCE