skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Reflow-oven-processing of pressureless sintered-silver interconnects

Abstract

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.

Authors:
 [1];  [2]; ORCiD logo [2]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1423101
Grant/Contract Number:
AC05-00OR22725
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Journal of Materials Processing Technology
Additional Journal Information:
Journal Volume: 255; Journal Issue: C; Journal ID: ISSN 0924-0136
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; Sintered-silver interconnects; Pressureless sintering; Reflow oven processing

Citation Formats

Wereszczak, Andrew A., Chen, Branndon R., and Oistad, Brian A.. Reflow-oven-processing of pressureless sintered-silver interconnects. United States: N. p., 2018. Web. doi:10.1016/j.jmatprotec.2018.01.001.
Wereszczak, Andrew A., Chen, Branndon R., & Oistad, Brian A.. Reflow-oven-processing of pressureless sintered-silver interconnects. United States. doi:10.1016/j.jmatprotec.2018.01.001.
Wereszczak, Andrew A., Chen, Branndon R., and Oistad, Brian A.. Thu . "Reflow-oven-processing of pressureless sintered-silver interconnects". United States. doi:10.1016/j.jmatprotec.2018.01.001.
@article{osti_1423101,
title = {Reflow-oven-processing of pressureless sintered-silver interconnects},
author = {Wereszczak, Andrew A. and Chen, Branndon R. and Oistad, Brian A.},
abstractNote = {Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.},
doi = {10.1016/j.jmatprotec.2018.01.001},
journal = {Journal of Materials Processing Technology},
number = C,
volume = 255,
place = {United States},
year = {Thu Jan 04 00:00:00 EST 2018},
month = {Thu Jan 04 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on January 4, 2019
Publisher's Version of Record

Save / Share: