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Title: Reflow-oven-processing of pressureless sintered-silver interconnects

Journal Article · · Journal of Materials Processing Technology
 [1];  [2]; ORCiD logo [2]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Oak Ridge Associated Univ., Oak Ridge, TN (United States)
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Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significant because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
Grant/Contract Number:
AC05-00OR22725
OSTI ID:
1423101
Journal Information:
Journal of Materials Processing Technology, Vol. 255, Issue C; ISSN 0924-0136
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 5 works
Citation information provided by
Web of Science

References (4)

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability journal May 2014
Effect of interconnection area on shear strength of sintered joint with nano‐silver paste journal February 2008
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? journal January 2014
Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material journal October 2014

Cited By (1)

Failure stress comparison of different pairings of Ag-plating and reflow-oven-processed pressureless-sintered-Ag interconnects journal October 2018

Figures / Tables (12)

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Figure 11.(p. 28)figure Figure 11.
Table 1.(p. 30)table Table 1.

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Related Subjects

36 MATERIALS SCIENCE
Sintered-silver interconnects
Pressureless sintering
Reflow oven processing