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Title: Electronic bulk and domain wall properties in B -site doped hexagonal ErMnO 3

Authors:
; ; ; ; ; ; ; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1422258
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Physical Review B
Additional Journal Information:
Journal Volume: 97; Journal Issue: 8; Related Information: CHORUS Timestamp: 2018-02-22 10:12:24; Journal ID: ISSN 2469-9950
Publisher:
American Physical Society
Country of Publication:
United States
Language:
English

Citation Formats

Holstad, T. S., Evans, D. M., Ruff, A., Småbråten, D. R., Schaab, J., Tzschaschel, Ch., Yan, Z., Bourret, E., Selbach, S. M., Krohns, S., and Meier, D. Electronic bulk and domain wall properties in B -site doped hexagonal ErMnO 3. United States: N. p., 2018. Web. doi:10.1103/PhysRevB.97.085143.
Holstad, T. S., Evans, D. M., Ruff, A., Småbråten, D. R., Schaab, J., Tzschaschel, Ch., Yan, Z., Bourret, E., Selbach, S. M., Krohns, S., & Meier, D. Electronic bulk and domain wall properties in B -site doped hexagonal ErMnO 3. United States. doi:10.1103/PhysRevB.97.085143.
Holstad, T. S., Evans, D. M., Ruff, A., Småbråten, D. R., Schaab, J., Tzschaschel, Ch., Yan, Z., Bourret, E., Selbach, S. M., Krohns, S., and Meier, D. Thu . "Electronic bulk and domain wall properties in B -site doped hexagonal ErMnO 3". United States. doi:10.1103/PhysRevB.97.085143.
@article{osti_1422258,
title = {Electronic bulk and domain wall properties in B -site doped hexagonal ErMnO 3},
author = {Holstad, T. S. and Evans, D. M. and Ruff, A. and Småbråten, D. R. and Schaab, J. and Tzschaschel, Ch. and Yan, Z. and Bourret, E. and Selbach, S. M. and Krohns, S. and Meier, D.},
abstractNote = {},
doi = {10.1103/PhysRevB.97.085143},
journal = {Physical Review B},
number = 8,
volume = 97,
place = {United States},
year = {Thu Feb 22 00:00:00 EST 2018},
month = {Thu Feb 22 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
This content will become publicly available on February 22, 2019
Publisher's Accepted Manuscript

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