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Title: Rad-hard Dual-threshold High-count-rate Silicon Pixel-array Detector

Abstract

In this program, a Voxtel-led team demonstrates a full-format (192 x 192, 100-µm pitch, VX-810) high-dynamic-range x-ray photon-counting sensor—the Dual Photon Resolved Energy Acquisition (DUPREA) sensor. Within the Phase II program the following tasks were completed: 1) system analysis and definition of the DUPREA sensor requirements; 2) design, simulation, and fabrication of the full-format VX-810 ROIC design; 3) design, optimization, and fabrication of thick, fully depleted silicon photodiodes optimized for x-ray photon collection; 4) hybridization of the VX-810 ROIC to the photodiode array in the creation of the optically sensitive focal-plane array; 5) development of an evaluation camera; and 6) electrical and optical characterization of the sensor.

Authors:
 [1]
  1. Voxtel, Inc., Beaverton, OR (United States)
Publication Date:
Research Org.:
Voxtel, Inc., Beaverton, OR (United States)
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1421588
Report Number(s):
DOE-VOXT-07543-1
DOE Contract Number:  
SC0007543
Type / Phase:
SBIR (Phase II)
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English

Citation Formats

Lee, Adam. Rad-hard Dual-threshold High-count-rate Silicon Pixel-array Detector. United States: N. p., 2017. Web.
Lee, Adam. Rad-hard Dual-threshold High-count-rate Silicon Pixel-array Detector. United States.
Lee, Adam. Mon . "Rad-hard Dual-threshold High-count-rate Silicon Pixel-array Detector". United States. doi:.
@article{osti_1421588,
title = {Rad-hard Dual-threshold High-count-rate Silicon Pixel-array Detector},
author = {Lee, Adam},
abstractNote = {In this program, a Voxtel-led team demonstrates a full-format (192 x 192, 100-µm pitch, VX-810) high-dynamic-range x-ray photon-counting sensor—the Dual Photon Resolved Energy Acquisition (DUPREA) sensor. Within the Phase II program the following tasks were completed: 1) system analysis and definition of the DUPREA sensor requirements; 2) design, simulation, and fabrication of the full-format VX-810 ROIC design; 3) design, optimization, and fabrication of thick, fully depleted silicon photodiodes optimized for x-ray photon collection; 4) hybridization of the VX-810 ROIC to the photodiode array in the creation of the optically sensitive focal-plane array; 5) development of an evaluation camera; and 6) electrical and optical characterization of the sensor.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Nov 20 00:00:00 EST 2017},
month = {Mon Nov 20 00:00:00 EST 2017}
}

Technical Report:
This technical report may be released as soon as February 17, 2022
Other availability
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