Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Chason, Eric; Guduru, Pradeep R.

doi:10.1063/1.4949263

Title: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Journal Article · Wed May 18 00:00:00 EDT 2016 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.4949263· OSTI ID:1421098

Chason, Eric; Guduru, Pradeep R.

Residual stress is a long-standing issue in thin film growth. Better understanding and control of film stress would lead to enhanced performance and reduced failures. In this work, we review how thin film stress is measured and interpreted. The results are used to describe a comprehensive picture that is emerging of what controls stress evolution. Examples from multiple studies are discussed to illustrate how the stress depends on key parameters (e.g., growth rate, material type, temperature, grain size, morphology, etc.). The corresponding stress-generating mechanisms that have been proposed to explain the data are also described. To develop a fuller understanding, we consider the kinetic factors that determine how much each of these processes contributes to the overall stress under different conditions. This leads to a kinetic model that can predict the dependence of the stress on multiple parameters. The model results are compared with the experiments to show how this approach can explain many features of stress evolution.

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Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: SC0008799

OSTI ID:: 1421098

Journal Information:: Journal of Applied Physics, Journal Name: Journal of Applied Physics Vol. 119 Journal Issue: 19; ISSN 0021-8979

Publisher:: American Institute of PhysicsCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 132 works

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