skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models

Authors:
 [1];  [1]
  1. School of Engineering, Brown University, Providence, Rhode Island 02912-9104, USA
Publication Date:
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1421098
Grant/Contract Number:  
SC0008799
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 119 Journal Issue: 19; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Chason, Eric, and Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models. United States: N. p., 2016. Web. doi:10.1063/1.4949263.
Chason, Eric, & Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models. United States. doi:10.1063/1.4949263.
Chason, Eric, and Guduru, Pradeep R. Sat . "Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models". United States. doi:10.1063/1.4949263.
@article{osti_1421098,
title = {Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models},
author = {Chason, Eric and Guduru, Pradeep R.},
abstractNote = {},
doi = {10.1063/1.4949263},
journal = {Journal of Applied Physics},
number = 19,
volume = 119,
place = {United States},
year = {Sat May 21 00:00:00 EDT 2016},
month = {Sat May 21 00:00:00 EDT 2016}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1063/1.4949263

Citation Metrics:
Cited by: 27 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Electromigration in thin aluminum films on titanium nitride
journal, April 1976

  • Blech, I. A.
  • Journal of Applied Physics, Vol. 47, Issue 4, p. 1203-1208
  • DOI: 10.1063/1.322842

Surface and interface stress effects in thin films
journal, May 1994


Origin of Compressive Residual Stress in Polycrystalline Thin Films
journal, March 2002