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Title: Cold plate

Abstract

A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Inventors:
; ; ;
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1420762
Patent Number(s):
9,894,801
Application Number:
15/339,710
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY) ORNL
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Oct 31
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Marroquin, Christopher M., O'Connell, Kevin M., Schultz, Mark D., and Tian, Shurong. Cold plate. United States: N. p., 2018. Web.
Marroquin, Christopher M., O'Connell, Kevin M., Schultz, Mark D., & Tian, Shurong. Cold plate. United States.
Marroquin, Christopher M., O'Connell, Kevin M., Schultz, Mark D., and Tian, Shurong. Tue . "Cold plate". United States. doi:. https://www.osti.gov/servlets/purl/1420762.
@article{osti_1420762,
title = {Cold plate},
author = {Marroquin, Christopher M. and O'Connell, Kevin M. and Schultz, Mark D. and Tian, Shurong},
abstractNote = {A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 13 00:00:00 EST 2018},
month = {Tue Feb 13 00:00:00 EST 2018}
}

Patent:

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