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Title: Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

Authors:
 [1];  [1]
  1. Department of Chemistry, University of California, Riverside, California 92521
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1420484
Grant/Contract Number:  
FG02-03ER46599
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Name: Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films Journal Volume: 33 Journal Issue: 1; Journal ID: ISSN 0734-2101
Publisher:
American Vacuum Society
Country of Publication:
United States
Language:
English

Citation Formats

Ma, Qiang, and Zaera, Francisco. Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface. United States: N. p., 2015. Web. doi:10.1116/1.4896940.
Ma, Qiang, & Zaera, Francisco. Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface. United States. doi:10.1116/1.4896940.
Ma, Qiang, and Zaera, Francisco. Thu . "Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface". United States. doi:10.1116/1.4896940.
@article{osti_1420484,
title = {Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface},
author = {Ma, Qiang and Zaera, Francisco},
abstractNote = {},
doi = {10.1116/1.4896940},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
number = 1,
volume = 33,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 2015},
month = {Thu Jan 01 00:00:00 EST 2015}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1116/1.4896940

Citation Metrics:
Cited by: 2 works
Citation information provided by
Web of Science

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