Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

Ma, Qiang; Zaera, Francisco

doi:10.1116/1.4896940

Title: Thermal chemistry of the Cu-KI5 atomic layer deposition precursor on a copper surface

Journal Article · Thu Jan 01 00:00:00 EST 2015 · Journal of Vacuum Science and Technology A

DOI:https://doi.org/10.1116/1.4896940· OSTI ID:1420484

Ma, Qiang ^[1]; Zaera, Francisco ^[1]

Department of Chemistry, University of California, Riverside, California 92521

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Sponsoring Organization:: USDOE

Grant/Contract Number:: FG02-03ER46599; SC0001839

OSTI ID:: 1420484

Journal Information:: Journal of Vacuum Science and Technology A, Journal Name: Journal of Vacuum Science and Technology A Vol. 33 Journal Issue: 1; ISSN 0734-2101

Publisher:: American Vacuum SocietyCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 10 works

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References (47)

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