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Title: Structure and electrochemical properties of copper wires with seamless 1D nanostructures

Authors:
; ; ; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1419579
Resource Type:
Journal Article: Published Article
Journal Name:
Data in Brief
Additional Journal Information:
Journal Name: Data in Brief; Journal ID: ISSN 2352-3409
Publisher:
Elsevier
Country of Publication:
United States
Language:
English

Citation Formats

Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, and Qin, Gaowu. Structure and electrochemical properties of copper wires with seamless 1D nanostructures. United States: N. p., 2018. Web. doi:10.1016/j.dib.2018.01.097.
Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, & Qin, Gaowu. Structure and electrochemical properties of copper wires with seamless 1D nanostructures. United States. doi:10.1016/j.dib.2018.01.097.
Wu, Yutong, Gao, Meiqi, Li, Song, Ren, Yuping, and Qin, Gaowu. Thu . "Structure and electrochemical properties of copper wires with seamless 1D nanostructures". United States. doi:10.1016/j.dib.2018.01.097.
@article{osti_1419579,
title = {Structure and electrochemical properties of copper wires with seamless 1D nanostructures},
author = {Wu, Yutong and Gao, Meiqi and Li, Song and Ren, Yuping and Qin, Gaowu},
abstractNote = {},
doi = {10.1016/j.dib.2018.01.097},
journal = {Data in Brief},
number = ,
volume = ,
place = {United States},
year = {Thu Feb 01 00:00:00 EST 2018},
month = {Thu Feb 01 00:00:00 EST 2018}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1016/j.dib.2018.01.097

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