Structure and electrochemical properties of copper wires with seamless 1D nanostructures
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 1419579
- Journal Information:
- Data in Brief, Journal Name: Data in Brief; ISSN 2352-3409
- Publisher:
- ElsevierCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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