Deformation response of cube-on-cube and non-coherent twin interfaces in AgCu eutectic after dynamic plastic compression

Eftink, Benjamin P.; Mara, Nathan Allan; Kingstedt, Owen T.; Safarik, Douglas Joseph; Wang, Shuai; Lambros, J.; Robertson, Ian M.

doi:10.1016/j.msea.2017.11.108

Title: Deformation response of cube-on-cube and non-coherent twin interfaces in AgCu eutectic after dynamic plastic compression

Journal Article · Sat Dec 02 00:00:00 EST 2017 · Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing

DOI:https://doi.org/10.1016/j.msea.2017.11.108· OSTI ID:1415383

^[1];

^[2]; Kingstedt, Owen T. ^[3];

^[2]; Wang, Shuai ^[4]; Lambros, J. ^[5]; Robertson, Ian M. ^[4]

Univ. of Illinois, Urbana, IL (United States)
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Univ. of Illinois, Urbana, IL (United States); University of Utah, Salt Lake City, UT (United States)
University of Wisconsin-Madison, Madison, WI (United States)
University of Utah, Salt Lake City, UT (United States)

For this research, Split-Hopkinson pressure bar dynamic compression experiments were conducted to determine the defect/interface interaction dependence on interface type, bilayer thickness and interface orientation with respect to the loading direction in the Ag-Cu eutectic system. Specifically, the deformation microstructure in alloys with either a cube-on-cube orientation relationship with {111}_Ag||{111}_Cu interface habit planes or a twin orientation relationship with {$$\overline{3}13$$}_Ag||{$$\overline{1}12$$}_Cu interface habit planes and with bilayer thicknesses of 500 nm, 1.1 µm and 2.2 µm were probed using TEM. The deformation was carried by dislocation slip and in certain conditions, deformation twinning. The twinning response was dependent on loading orientation with respect to the interface plane, bilayer thickness, and interface type. Twinning was only observed when loading at orientations away from the growth direction and decreased in prevalence with decreasing bilayer thickness. Twinning in Cu was dependent on twinning partial dislocations being transmitted from Ag, which only occurred for cube-on-cube interfaces. Lastly, dislocation slip and deformation twin transfer across the interfaces is discussed in terms of the slip transfer conditions developed for grain boundaries in FCC alloys.

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Research Organization:: Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC)

Grant/Contract Number:: AC52-06NA25396; FG52-09NA29463

OSTI ID:: 1415383

Alternate ID(s):: OSTI ID: 1549172

Report Number(s):: LA-UR-17-24245; TRN: US1800785

Journal Information:: Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing, Vol. 712; ISSN 0921-5093

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 10 works

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