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Title: Thermal history-based etching

Abstract

A method for adjusting an etchability of a first borosilicate glass by heating the first borosilicate glass; combining the first borosilicate glass with a second borosilicate glass to form a composite; and etching the composite with an etchant. A material having a protrusive phase and a recessive phase, where the protrusive phase protrudes from the recessive phase to form a plurality of nanoscale surface features, and where the protrusive phase and the recessive phase have the same composition.

Inventors:
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1410558
Patent Number(s):
9,828,284
Application Number:
14/229,385
Assignee:
UT-BATTELLE, LLC (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Mar 28
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Simpson, John T. Thermal history-based etching. United States: N. p., 2017. Web.
Simpson, John T. Thermal history-based etching. United States.
Simpson, John T. Tue . "Thermal history-based etching". United States. doi:. https://www.osti.gov/servlets/purl/1410558.
@article{osti_1410558,
title = {Thermal history-based etching},
author = {Simpson, John T.},
abstractNote = {A method for adjusting an etchability of a first borosilicate glass by heating the first borosilicate glass; combining the first borosilicate glass with a second borosilicate glass to form a composite; and etching the composite with an etchant. A material having a protrusive phase and a recessive phase, where the protrusive phase protrudes from the recessive phase to form a plurality of nanoscale surface features, and where the protrusive phase and the recessive phase have the same composition.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 28 00:00:00 EST 2017},
month = {Tue Nov 28 00:00:00 EST 2017}
}

Patent:

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