Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.
Abstract
Abstract not provided.
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
- OSTI Identifier:
- 1409913
- Report Number(s):
- SAND2016-11713C
649222
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Conference
- Resource Relation:
- Conference: Proposed for presentation at the FABTECH held November 16-18, 2016 in Las Vegas, NV.
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States: N. p., 2016.
Web.
Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States.
Vianco, Paul T. 2016.
"Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.". United States. https://www.osti.gov/servlets/purl/1409913.
@article{osti_1409913,
title = {Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.},
author = {Vianco, Paul T.},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1409913},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 01 00:00:00 EDT 2016},
month = {Tue Nov 01 00:00:00 EDT 2016}
}
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