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Title: Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.

Abstract

Abstract not provided.

Authors:
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security
OSTI Identifier:
1409913
Report Number(s):
SAND2016-11713C
649222
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the FABTECH held November 16-18, 2016 in Las Vegas, NV.
Country of Publication:
United States
Language:
English

Citation Formats

Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States: N. p., 2016. Web.
Vianco, Paul T. Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.. United States.
Vianco, Paul T. 2016. "Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.". United States. https://www.osti.gov/servlets/purl/1409913.
@article{osti_1409913,
title = {Understanding the Reliability of Solder Joints Used in Advanced Structural and Electronics Applications.},
author = {Vianco, Paul T.},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1409913}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 01 00:00:00 EDT 2016},
month = {Tue Nov 01 00:00:00 EDT 2016}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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