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Title: Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

Abstract

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. But, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. This work provides a useful perspective on the microscopic processes governing interfacial heat conduction.

Authors:
ORCiD logo [1];  [2];  [3];  [2]
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). BioEnergy Science Center (BESC)
  2. California Inst. of Technology (CalTech), Pasadena, CA (United States)
  3. Boston College, Chestnut Hill, MA (United States)
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE; National Science Foundation (NSF)
OSTI Identifier:
1407989
Grant/Contract Number:  
AC05-00OR22725; CBET 1254213
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Physical Review B
Additional Journal Information:
Journal Volume: 95; Journal Issue: 20; Journal ID: ISSN 2469-9950
Publisher:
American Physical Society (APS)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Hua, Chengyun, Chen, Xiangwen, Ravichandran, Navaneetha K., and Minnich, Austin J. Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces. United States: N. p., 2017. Web. doi:10.1103/PhysRevB.95.205423.
Hua, Chengyun, Chen, Xiangwen, Ravichandran, Navaneetha K., & Minnich, Austin J. Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces. United States. doi:10.1103/PhysRevB.95.205423.
Hua, Chengyun, Chen, Xiangwen, Ravichandran, Navaneetha K., and Minnich, Austin J. Wed . "Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces". United States. doi:10.1103/PhysRevB.95.205423. https://www.osti.gov/servlets/purl/1407989.
@article{osti_1407989,
title = {Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces},
author = {Hua, Chengyun and Chen, Xiangwen and Ravichandran, Navaneetha K. and Minnich, Austin J.},
abstractNote = {Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. But, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. This work provides a useful perspective on the microscopic processes governing interfacial heat conduction.},
doi = {10.1103/PhysRevB.95.205423},
journal = {Physical Review B},
issn = {2469-9950},
number = 20,
volume = 95,
place = {United States},
year = {2017},
month = {5}
}

Journal Article:
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Cited by: 12 works
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Works referenced in this record:

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