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Title: Method of accurate thickness measurement of boron carbide coating on copper foil

Abstract

A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.

Inventors:
;
Publication Date:
Research Org.:
Proportional Technologies, Inc. Houston, TX (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1407708
Patent Number(s):
9,810,635
Application Number:
14/938,903
Assignee:
Proportional Technologies, Inc. CHO
DOE Contract Number:
SC0009615
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Nov 12
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Lacy, Jeffrey L., and Regmi, Murari. Method of accurate thickness measurement of boron carbide coating on copper foil. United States: N. p., 2017. Web.
Lacy, Jeffrey L., & Regmi, Murari. Method of accurate thickness measurement of boron carbide coating on copper foil. United States.
Lacy, Jeffrey L., and Regmi, Murari. Tue . "Method of accurate thickness measurement of boron carbide coating on copper foil". United States. doi:. https://www.osti.gov/servlets/purl/1407708.
@article{osti_1407708,
title = {Method of accurate thickness measurement of boron carbide coating on copper foil},
author = {Lacy, Jeffrey L. and Regmi, Murari},
abstractNote = {A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 07 00:00:00 EST 2017},
month = {Tue Nov 07 00:00:00 EST 2017}
}

Patent:

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