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Title: Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report

Abstract

As maximum device temperatures approach 200 °Celsius, continuous operation, sintered silver materials promise to maintain bonds at these high temperatures without excessive degradation rates. A detailed characterization of the thermal performance and reliability of sintered silver materials and processes has been initiated for the next year. Future steps in crack modeling include efforts to simulate crack propagation directly using the extended finite element method (X-FEM), a numerical technique that uses the partition of unity method for modeling discontinuities such as cracks in a system.

Authors:
 [1]
  1. National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1404872
Report Number(s):
NREL/MP-5400-67117
DOE Contract Number:
AC36-08GO28308
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
30 DIRECT ENERGY CONVERSION; power electronics; bonded interfaces, high-temperature packaging; sintered silver; thermal performance; reliability; crack propagation

Citation Formats

DeVoto, Douglas J. Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report. United States: N. p., 2017. Web. doi:10.2172/1404872.
DeVoto, Douglas J. Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report. United States. doi:10.2172/1404872.
DeVoto, Douglas J. Thu . "Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report". United States. doi:10.2172/1404872. https://www.osti.gov/servlets/purl/1404872.
@article{osti_1404872,
title = {Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report},
author = {DeVoto, Douglas J.},
abstractNote = {As maximum device temperatures approach 200 °Celsius, continuous operation, sintered silver materials promise to maintain bonds at these high temperatures without excessive degradation rates. A detailed characterization of the thermal performance and reliability of sintered silver materials and processes has been initiated for the next year. Future steps in crack modeling include efforts to simulate crack propagation directly using the extended finite element method (X-FEM), a numerical technique that uses the partition of unity method for modeling discontinuities such as cracks in a system.},
doi = {10.2172/1404872},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Oct 19 00:00:00 EDT 2017},
month = {Thu Oct 19 00:00:00 EDT 2017}
}

Technical Report:

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