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Laser-induced gas plasma machining

Patent ·
OSTI ID:1400251
Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser energy to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal.
Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-07NA27344
Assignee:
Lawrence Livermore National Security, LLC
Patent Number(s):
9,790,090
Application Number:
13/797,495
OSTI ID:
1400251
Country of Publication:
United States
Language:
English

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