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Title: Solid state lighting component

Abstract

An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

Inventors:
; ; ; ; ; ;
Publication Date:
Research Org.:
CREE, INC., Goleta, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1399784
Patent Number(s):
9,793,247
Application Number:
12/156,995
Assignee:
CREE, INC. NETL
DOE Contract Number:
FC26-06NT42932
Resource Type:
Patent
Resource Relation:
Patent File Date: 2008 Jun 05
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Yuan, Thomas, Keller, Bernd, Tarsa, Eric, Ibbetson, James, Morgan, Frederick, Dowling, Kevin, and Lys, Ihor. Solid state lighting component. United States: N. p., 2017. Web.
Yuan, Thomas, Keller, Bernd, Tarsa, Eric, Ibbetson, James, Morgan, Frederick, Dowling, Kevin, & Lys, Ihor. Solid state lighting component. United States.
Yuan, Thomas, Keller, Bernd, Tarsa, Eric, Ibbetson, James, Morgan, Frederick, Dowling, Kevin, and Lys, Ihor. Tue . "Solid state lighting component". United States. doi:. https://www.osti.gov/servlets/purl/1399784.
@article{osti_1399784,
title = {Solid state lighting component},
author = {Yuan, Thomas and Keller, Bernd and Tarsa, Eric and Ibbetson, James and Morgan, Frederick and Dowling, Kevin and Lys, Ihor},
abstractNote = {An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 17 00:00:00 EDT 2017},
month = {Tue Oct 17 00:00:00 EDT 2017}
}

Patent:

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  • An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
  • An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
  • An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
  • Solid state lighting devices and methods for heat dissipation with rotary cooling structures are described. An example solid state lighting device includes a solid state light source, a rotating heat transfer structure in thermal contact with the solid state light source, and a mounting assembly having a stationary portion. The mounting assembly may be rotatably coupled to the heat transfer structure such that at least a portion of the mounting assembly remains stationary while the heat transfer structure is rotating. Examples of methods for dissipating heat from electrical devices, such as solid state lighting sources are also described. Heat dissipationmore » methods may include providing electrical power to a solid state light source mounted to and in thermal contact with a heat transfer structure, and rotating the heat transfer structure through a surrounding medium.« less
  • The workshop participants enthusiastically concluded that the time is ripe for new fundamental science to beget a revolution in lighting technology. SSL sources based on organic and inorganic materials have reached a level of efficiency where it is possible to envision their use for general illumination. The research areas articulated in this report are targeted to enable disruptive advances in SSL performance and realization of this dream. Broad penetration of SSL technology into the mass lighting market, accompanied by vast savings in energy usage, requires nothing less. These new ?good ideas? will be represented not by light bulbs, but bymore » an entirely new lighting technology for the 21st century and a bright, energy-efficient future indeed.« less