Non-hydrolytic metal oxide films for perovskite halide overcoating and stabilization
Abstract
A method of protecting a perovskite halide film from moisture and temperature includes positioning the perovskite halide film in a chamber. The chamber is maintained at a temperature of less than 200 degrees Celsius. An organo-metal compound is inserted into the chamber. A non-hydrolytic oxygen source is subsequently inserted into the chamber. The inserting of the organo-metal compound and subsequent inserting of the non-hydrolytic oxygen source into the chamber is repeated for a predetermined number of cycles. The non-hydrolytic oxygen source and the organo-metal compound interact in the chamber to deposit a non-hydrolytic metal oxide film on perovskite halide film. The non-hydrolytic metal oxide film protects the perovskite halide film from relative humidity of greater than 35% and a temperature of greater than 150 degrees Celsius, respectively.
- Inventors:
- Publication Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1399090
- Patent Number(s):
- 9,773,991
- Application Number:
- 14/819,248
- Assignee:
- UCHICAGO ARGONNE, LLC
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Aug 05
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Martinson, Alex B., and Kim, In Soo. Non-hydrolytic metal oxide films for perovskite halide overcoating and stabilization. United States: N. p., 2017.
Web.
Martinson, Alex B., & Kim, In Soo. Non-hydrolytic metal oxide films for perovskite halide overcoating and stabilization. United States.
Martinson, Alex B., and Kim, In Soo. Tue .
"Non-hydrolytic metal oxide films for perovskite halide overcoating and stabilization". United States. https://www.osti.gov/servlets/purl/1399090.
@article{osti_1399090,
title = {Non-hydrolytic metal oxide films for perovskite halide overcoating and stabilization},
author = {Martinson, Alex B. and Kim, In Soo},
abstractNote = {A method of protecting a perovskite halide film from moisture and temperature includes positioning the perovskite halide film in a chamber. The chamber is maintained at a temperature of less than 200 degrees Celsius. An organo-metal compound is inserted into the chamber. A non-hydrolytic oxygen source is subsequently inserted into the chamber. The inserting of the organo-metal compound and subsequent inserting of the non-hydrolytic oxygen source into the chamber is repeated for a predetermined number of cycles. The non-hydrolytic oxygen source and the organo-metal compound interact in the chamber to deposit a non-hydrolytic metal oxide film on perovskite halide film. The non-hydrolytic metal oxide film protects the perovskite halide film from relative humidity of greater than 35% and a temperature of greater than 150 degrees Celsius, respectively.},
doi = {},
url = {https://www.osti.gov/biblio/1399090},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {9}
}