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Title: Interface mediated mechanisms of plastic strain recovery in a AgCu alloy

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Publication Date:
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
Grant/Contract Number:
Resource Type:
Journal Article: Publisher's Accepted Manuscript
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 117; Journal Issue: C; Related Information: CHORUS Timestamp: 2017-10-04 22:17:25; Journal ID: ISSN 1359-6454
Country of Publication:
United States

Citation Formats

Eftink, B. P., Li, A., Szlufarska, I., and Robertson, I. M. Interface mediated mechanisms of plastic strain recovery in a AgCu alloy. United States: N. p., 2016. Web. doi:10.1016/j.actamat.2016.07.010.
Eftink, B. P., Li, A., Szlufarska, I., & Robertson, I. M. Interface mediated mechanisms of plastic strain recovery in a AgCu alloy. United States. doi:10.1016/j.actamat.2016.07.010.
Eftink, B. P., Li, A., Szlufarska, I., and Robertson, I. M. 2016. "Interface mediated mechanisms of plastic strain recovery in a AgCu alloy". United States. doi:10.1016/j.actamat.2016.07.010.
title = {Interface mediated mechanisms of plastic strain recovery in a AgCu alloy},
author = {Eftink, B. P. and Li, A. and Szlufarska, I. and Robertson, I. M.},
abstractNote = {},
doi = {10.1016/j.actamat.2016.07.010},
journal = {Acta Materialia},
number = C,
volume = 117,
place = {United States},
year = 2016,
month = 9

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record at 10.1016/j.actamat.2016.07.010

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  • For this research, Split-Hopkinson pressure bar dynamic compression experiments were conducted to determine the defect/interface interaction dependence on interface type, bilayer thickness and interface orientation with respect to the loading direction in the Ag-Cu eutectic system. Specifically, the deformation microstructure in alloys with either a cube-on-cube orientation relationship with {111} Ag||{111} Cu interface habit planes or a twin orientation relationship with {more » $$\overline{3}13$$} Ag||{$$\overline{1}12$$} Cu interface habit planes and with bilayer thicknesses of 500 nm, 1.1 µm and 2.2 µm were probed using TEM. The deformation was carried by dislocation slip and in certain conditions, deformation twinning. The twinning response was dependent on loading orientation with respect to the interface plane, bilayer thickness, and interface type. Twinning was only observed when loading at orientations away from the growth direction and decreased in prevalence with decreasing bilayer thickness. Twinning in Cu was dependent on twinning partial dislocations being transmitted from Ag, which only occurred for cube-on-cube interfaces. Lastly, dislocation slip and deformation twin transfer across the interfaces is discussed in terms of the slip transfer conditions developed for grain boundaries in FCC alloys.« less
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  • The behavior of specimens dynamically loaded during split Hopkinson (Kolsky) bar tests in a regime close to simple shear conditions was studied. The lateral surface of the specimens was investigated in-situ using a high-speed infrared camera CEDIP Silver 450M. The temperature field distribution obtained at different time allowed one to trace the evolution of plastic strain localization. The process of target perforation involving plug formation and ejection was examined using a high-speed infrared camera and a VISAR velocity measurement system. The microstructure of tested specimens was analyzed using an optical interferometer-profiler and a scanning electron microscope. The development of plasticmore » shear instability regions has been simulated numerically.« less
  • Deformation around two scratches in Alloy 600 (A600) was studied nondestructively using synchrotron Laue differential aperture X-ray microscopy. The orientation of grains and elastic strain distribution around the scratches were measured. A complex residual deviatoric elastic strain state was found to exist around the scratches. Heavy plastic deformation was observed up to a distance of 20 {micro}m from the scratches. In the region 20-30 {micro}m from the scratches the diffraction spots were heavily streaked and split indicating misoriented dislocation cell structures.
  • Fatigue failure of a component occurs through an irrecoverable energy dissipating process. The alloy dissipates most of the plastic strain energy as heat, the other forms being vibration and acoustic emission. Some energy will be absorbed by immobile life defects and by surface damage processes. In order to gain greater understanding of the material response to fatigue damage, it is necessary to propose a physical quantity with energy dissipation as a fatigue damage parameter. Two such widely used fatigue damage parameters are the average plastic strain energy per cycle ([Delta]W[sub p]), the area under the hysteresis loop during low cyclemore » fatigue and the total dissipated energy (W[sub f]), the sum of the areas of all the loops before failure. Each alloy has a certain capacity to dissipate the plastic strain energy. When this limit is attained, the cracks which originated during the earlier cycling will propagate and failure occurs. This paper presents the results of the analysis of the low cycle fatigue data obtained in the case of a quaternary Al-Li-Cu-Mg alloy. The aim of this analysis is to provide further understanding on the bilinear nature of the Coffin-Manson power law relationship, which has already been reported by several researchers.« less