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Title: Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction

Journal Article · · Solar Energy Materials and Solar Cells
 [1];  [2];  [2];  [2];  [3];  [4];  [5];  [6]
  1. Singapore University of Technology and Design (Singapore); Surya University, Tangerang (Indonesia)
  2. Singapore University of Technology and Design (Singapore)
  3. Buddhi Dharma University, Tangerang (Indonesia)
  4. Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)
  5. Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)
  6. Singapore University of Technology and Design (Singapore); SunPower Corporation, R&D, San Jose, CA (United States)

Thin ( < 150 µm) silicon solar cell technology is attractive due to the significant cost reduction associated with it. Consequently, fracture mechanisms in the thin silicon solar cells during soldering and lamination need to be fully understood quantitatively in order to enable photovoltaics (PV) systems implementation in both manufacturing and field operations. Synchrotron X-ray Microdiffraction (µSXRD) has proven to be a very effective means to quantitatively probe the mechanical stress which is the driving force of the fracture mechanisms (initiation, propagation, and propensity) in the thin silicon solar cells, especially when they are already encapsulated. Here in this article, we present the first ever stress examination in encapsulated thin silicon solar cells and show how nominally the same silicon solar cells encapsulated by different polymer encapsulants could have very different residual stresses after the lamination process. It is then not difficult to see how the earlier observation, as reported by Sander et al. (2013) [1], of very different fracture rates within the same silicon solar cells encapsulated by different Ethylene Vinyl Acetate (EVA) materials could come about. Finally, the complete second degree tensor components of the residual stress of the silicon solar cells after lamination process are also reported in this paper signifying the full and unique capabilities of the Synchrotron X-Ray Microdiffraction technique not only for measuring residual stress but also for measuring other potential mechanical damage within thin silicon solar cells.

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES); National Science Foundation (NSF); National Research Foundation of Korea (NRF); Economic Development Board (EDB) of Singapore
Grant/Contract Number:
AC02-05CH11231; NRF2013EWT-EIRP002-017; 0416243.
OSTI ID:
1379787
Alternate ID(s):
OSTI ID: 1396880
Journal Information:
Solar Energy Materials and Solar Cells, Vol. 162, Issue C; ISSN 0927-0248
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 29 works
Citation information provided by
Web of Science

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