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Title: Sandia National Laboratories Microelectronics Overview.


Abstract not provided.

Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
Report Number(s):
DOE Contract Number:
Resource Type:
Resource Relation:
Conference: Proposed for presentation at the Atomic Weapons Establishment presentation held September 29, 2016 in Albuquerque, NM.
Country of Publication:
United States

Citation Formats

Molley, Perry A., and Sanchez, Reno Lee. Sandia National Laboratories Microelectronics Overview.. United States: N. p., 2016. Web.
Molley, Perry A., & Sanchez, Reno Lee. Sandia National Laboratories Microelectronics Overview.. United States.
Molley, Perry A., and Sanchez, Reno Lee. Thu . "Sandia National Laboratories Microelectronics Overview.". United States. doi:.
title = {Sandia National Laboratories Microelectronics Overview.},
author = {Molley, Perry A. and Sanchez, Reno Lee},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Sep 01 00:00:00 EDT 2016},
month = {Thu Sep 01 00:00:00 EDT 2016}

Other availability
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  • The Microelectronics Development Laboratory (MDL) contains 3,000 m{sup 2}, Which includes 1,000 m{sup 2}of Class I clean room space. There are 20 laminar flow Class I clean room bays. The MDL supplies several, full-flow process technologies which produce complementary metal oxide semiconductor (CMOS) integrated circuits using 150 nun diameter silicon wafers. All gases, chemicals and physical hazards used in the fabrication processes are controlled to levels well below regulatory requirements. Facility engineering controls in the MDL include toxic and pyrophoric gas monitoring, interlocks, ventilation, substitution and chemical segregation. Toxic and pyrophoric gases are monitored continuously inside processing tools as wellmore » as through the exhaust lines, gas cabinets, the valve boxes, and in general work areas. The toxic gas monitoring systems are interlocked to gas shutoff valves and have both low and high level alarms. In-use process gases are stored in exhausted cabinets. All chemicals and gases are segregated by chemical type. The processes are organized into eight sector areas that consist of photolithography, wet processes, dry etch, ion implant, metals, diffusion, chemical vapor deposition (CVD) and chemical mechanical polishing (CW). Each morning, engineering, safety and facilities personnel meet to review the equipment and wafer lot status and discuss processing issues. Hazards are assessed in the MDL with periodic walkthroughs, continuous toxic and pyrophoric gas monitoring and personal monitoring. All chemicals and gases proposed for use in the MDL are reviewed by the industrial hygienist and must be approved by a manager before they are purchased. All new equipment and processes are reviewed by a hazard and barrier committee and cannot be used in the MDL without the committee`s approval and an IH hazard assessment. Overall risk of operating the MDL has been reduced to a level that is as low as reasonable achievable for this research facility.« less
  • No abstract prepared.
  • No abstract prepared.
  • No abstract prepared.