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Title: Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint

Abstract

Thermal interface materials (TIMs) are an integral and important part of thermal management in electronic devices. The electronic devices are becoming more compact and powerful. This increase in power processed or passing through the devices leads to higher heat fluxes and makes it a challenge to maintain temperatures at the optimal level during operation. Herein, we report a free standing nanocomposite TIM in which boron nitride nanosheets (BNNS) are uniformly dispersed in copper matrices via an organic linker, thiosemicarbazide. Integration of these metal-organic-inorganic nanocomposites was made possible by a novel electrodeposition technique where the functionalized BNNS (f-BNNS) experience the Brownian motion and reach the cathode through diffusion, while the nucleation and growth of the copper on the cathode occurs via the electrochemical reduction. Once the f-BNNS bearing carbonothioyl/thiol groups on the terminal edges come into the contact with copper crystals, the chemisorption reaction takes place. We performed thermal, mechanical, and structural characterization of these nanocomposites using scanning electron microcopy (SEM), diffusive laser flash (DLF) analysis, phase-sensitive transient thermoreflectence (PSTTR), and nanoindentation. The nanocomposites exhibited a thermal conductivity ranging from 211 W/mK to 277 W/mK at a filler mass loading of 0-12 wt.percent. The nanocomposites also have about 4 times lowermore » hardness as compared to copper, with values ranging from 0.27 GPa to 0.41 GPa. The structural characterization studies showed that most of the BNNS are localized at grain boundaries - which enable efficient thermal transport while making the material soft. PSTTR measurements revealed that the synergistic combinations of these properties yielded contact resistances on the order of 0.10 to 0.13 mm2K/W, and the total thermal resistance of 0.38 to 0.56 mm2K/W at bondline thicknesses of 30-50 um. The coefficient of thermal expansion (CTE) of the nanocomposite is 11 ppm/K, which lies between the CTEs of aluminum (22 ppm/K) and silicon (3 ppm/K), which are common heat sink and heat source materials, respectively. The nanocomposite can also be deposited directly on to heat sink which will simplify the packaging processes by removing one possible element to assemble. These unique properties and ease of assembly makes the nanocomposite a promising next-generation TIM.« less

Authors:
 [1]; ORCiD logo [1];  [1];  [2];  [2];  [2];  [2]
  1. National Renewable Energy Laboratory (NREL), Golden, CO (United States)
  2. Texas A&M University
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies Office (EE-3V)
OSTI Identifier:
1393368
Report Number(s):
NREL/CP-5400-68120
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017) Conference, 30 May - 2 June 2017, Orlando, Florida
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; TIM; nanocomposite; electrodeposition; thermal management; power electronics; thermal interface materials

Citation Formats

Feng, Xuhui, Narumanchi, Sreekant V, King, Charles C, Nagabandi, Nirup, Oh, Jun K., Akbulut, Mustafa, and Yegin, Cengiz. Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint. United States: N. p., 2017. Web.
Feng, Xuhui, Narumanchi, Sreekant V, King, Charles C, Nagabandi, Nirup, Oh, Jun K., Akbulut, Mustafa, & Yegin, Cengiz. Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint. United States.
Feng, Xuhui, Narumanchi, Sreekant V, King, Charles C, Nagabandi, Nirup, Oh, Jun K., Akbulut, Mustafa, and Yegin, Cengiz. Thu . "Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint". United States. doi:. https://www.osti.gov/servlets/purl/1393368.
@article{osti_1393368,
title = {Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint},
author = {Feng, Xuhui and Narumanchi, Sreekant V and King, Charles C and Nagabandi, Nirup and Oh, Jun K. and Akbulut, Mustafa and Yegin, Cengiz},
abstractNote = {Thermal interface materials (TIMs) are an integral and important part of thermal management in electronic devices. The electronic devices are becoming more compact and powerful. This increase in power processed or passing through the devices leads to higher heat fluxes and makes it a challenge to maintain temperatures at the optimal level during operation. Herein, we report a free standing nanocomposite TIM in which boron nitride nanosheets (BNNS) are uniformly dispersed in copper matrices via an organic linker, thiosemicarbazide. Integration of these metal-organic-inorganic nanocomposites was made possible by a novel electrodeposition technique where the functionalized BNNS (f-BNNS) experience the Brownian motion and reach the cathode through diffusion, while the nucleation and growth of the copper on the cathode occurs via the electrochemical reduction. Once the f-BNNS bearing carbonothioyl/thiol groups on the terminal edges come into the contact with copper crystals, the chemisorption reaction takes place. We performed thermal, mechanical, and structural characterization of these nanocomposites using scanning electron microcopy (SEM), diffusive laser flash (DLF) analysis, phase-sensitive transient thermoreflectence (PSTTR), and nanoindentation. The nanocomposites exhibited a thermal conductivity ranging from 211 W/mK to 277 W/mK at a filler mass loading of 0-12 wt.percent. The nanocomposites also have about 4 times lower hardness as compared to copper, with values ranging from 0.27 GPa to 0.41 GPa. The structural characterization studies showed that most of the BNNS are localized at grain boundaries - which enable efficient thermal transport while making the material soft. PSTTR measurements revealed that the synergistic combinations of these properties yielded contact resistances on the order of 0.10 to 0.13 mm2K/W, and the total thermal resistance of 0.38 to 0.56 mm2K/W at bondline thicknesses of 30-50 um. The coefficient of thermal expansion (CTE) of the nanocomposite is 11 ppm/K, which lies between the CTEs of aluminum (22 ppm/K) and silicon (3 ppm/K), which are common heat sink and heat source materials, respectively. The nanocomposite can also be deposited directly on to heat sink which will simplify the packaging processes by removing one possible element to assemble. These unique properties and ease of assembly makes the nanocomposite a promising next-generation TIM.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Sep 14 00:00:00 EDT 2017},
month = {Thu Sep 14 00:00:00 EDT 2017}
}

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