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Title: High flux diode packaging using passive microscale liquid-vapor phase change

Abstract

A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1393161
Patent Number(s):
9,768,584
Application Number:
15/080,507
Assignee:
Lawrence Livermore National Security, LLC LLNL
DOE Contract Number:
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Mar 24
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE

Citation Formats

Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, and Patra, Susant. High flux diode packaging using passive microscale liquid-vapor phase change. United States: N. p., 2017. Web.
Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, & Patra, Susant. High flux diode packaging using passive microscale liquid-vapor phase change. United States.
Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, and Patra, Susant. 2017. "High flux diode packaging using passive microscale liquid-vapor phase change". United States. doi:. https://www.osti.gov/servlets/purl/1393161.
@article{osti_1393161,
title = {High flux diode packaging using passive microscale liquid-vapor phase change},
author = {Bandhauer, Todd and Deri, Robert J. and Elmer, John W. and Kotovsky, Jack and Patra, Susant},
abstractNote = {A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2017,
month = 9
}

Patent:

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