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Title: Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding

Abstract

In this study, we present an improved method to bond poly(dimethylsiloxane) (PDMS) with polyimide (PI) to develop flexible substrate microfluidic devices. The PI film was separately fabricated on a silicon wafer by spin coating followed by thermal treatment to avoid surface unevenness of the flexible substrate. In this way, we could also integrate flexible substrate into standard micro-electromechanical systems (MEMS) fabrication. Meanwhile, the adhesive epoxy was selectively transferred to the PDMS microfluidic device by a stamp-and-stick method to avoid epoxy clogging the microfluidic channels. To spread out the epoxy evenly on the transferring substrate, we used superhydrophilic vanadium oxide film coated glass as the transferring substrate. After the bonding process, the flexible substrate could easily be peeled off from the rigid substrate. Contact angle measurement was used to characterize the hydrophicity of the vanadium oxide film. X-ray photoelectron spectroscopy analysis was conducted to study the surface of the epoxy. We further evaluated the bonding quality by peeling tests, which showed a maximum bonding strength of 100 kPa. By injecting with black ink, the plastic microfluidic device was confirmed to be well bonded with no leakage for a day under 1 atm. Finally, this proposed versatile method could bond the microfluidicmore » device and plastic substrate together and be applied in the fabrication of some biosensors and lab-on-a-chip systems.« less

Authors:
 [1];  [2];  [3];  [2]
  1. Stony Brook Univ., NY (United States)
  2. Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)
  3. Brookhaven National Lab. (BNL), Upton, NY (United States)
Publication Date:
Research Org.:
Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States); Brookhaven National Lab. (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE Office of Science (SC); National Science Foundation (NSF); AbbVie Inc. (United States)
OSTI Identifier:
1392268
Report Number(s):
BNL-114324-2017-JA
Journal ID: ISSN 0960-1317; KC0403020
Grant/Contract Number:  
SC0012704; IDBR-1530508
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Additional Journal Information:
Journal Volume: 27; Journal Issue: 5; Journal ID: ISSN 0960-1317
Publisher:
IOP Publishing
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; microfluidic device; flexible substrate; polyimide (PI); polydimethylsiloxane (PDMS); adhesive bonding; superhydrophilic; stamp-and-stick; Center for Functional Nanomaterials

Citation Formats

Wang, Shuyu, Yu, Shifeng, Lu, Ming, and Zuo, Lei. Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding. United States: N. p., 2017. Web. doi:10.1088/1361-6439/aa66ed.
Wang, Shuyu, Yu, Shifeng, Lu, Ming, & Zuo, Lei. Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding. United States. https://doi.org/10.1088/1361-6439/aa66ed
Wang, Shuyu, Yu, Shifeng, Lu, Ming, and Zuo, Lei. 2017. "Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding". United States. https://doi.org/10.1088/1361-6439/aa66ed. https://www.osti.gov/servlets/purl/1392268.
@article{osti_1392268,
title = {Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding},
author = {Wang, Shuyu and Yu, Shifeng and Lu, Ming and Zuo, Lei},
abstractNote = {In this study, we present an improved method to bond poly(dimethylsiloxane) (PDMS) with polyimide (PI) to develop flexible substrate microfluidic devices. The PI film was separately fabricated on a silicon wafer by spin coating followed by thermal treatment to avoid surface unevenness of the flexible substrate. In this way, we could also integrate flexible substrate into standard micro-electromechanical systems (MEMS) fabrication. Meanwhile, the adhesive epoxy was selectively transferred to the PDMS microfluidic device by a stamp-and-stick method to avoid epoxy clogging the microfluidic channels. To spread out the epoxy evenly on the transferring substrate, we used superhydrophilic vanadium oxide film coated glass as the transferring substrate. After the bonding process, the flexible substrate could easily be peeled off from the rigid substrate. Contact angle measurement was used to characterize the hydrophicity of the vanadium oxide film. X-ray photoelectron spectroscopy analysis was conducted to study the surface of the epoxy. We further evaluated the bonding quality by peeling tests, which showed a maximum bonding strength of 100 kPa. By injecting with black ink, the plastic microfluidic device was confirmed to be well bonded with no leakage for a day under 1 atm. Finally, this proposed versatile method could bond the microfluidic device and plastic substrate together and be applied in the fabrication of some biosensors and lab-on-a-chip systems.},
doi = {10.1088/1361-6439/aa66ed},
url = {https://www.osti.gov/biblio/1392268}, journal = {Journal of Micromechanics and Microengineering. Structures, Devices and Systems},
issn = {0960-1317},
number = 5,
volume = 27,
place = {United States},
year = {2017},
month = {3}
}

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Works referenced in this record:

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  • Ahmed, Moinuddin; Butler, Donald P.
  • Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 31, Issue 5
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