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Title: Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)

Abstract

Abstract Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22); U.S. Army Research Laboratory - U.S. Army Research Office (ARO); USDOE Office of Science - Office of Basic Energy Sciences - Scientific User Facilities Division
OSTI Identifier:
1392092
DOE Contract Number:
AC02-06CH11357
Resource Type:
Journal Article
Resource Relation:
Journal Name: Microscopy and Microanalysis; Journal Volume: 22; Journal Issue: 04
Country of Publication:
United States
Language:
English
Subject:
Lead-free solder; Synchrotron radiation; Three-dimensional tomography; 3D reconstruction; Transmission X-ray Microscopy

Citation Formats

Kaira, Chandrashekara S., Mayer, Carl R., De Andrade, V., De Carlo, Francesco, and Chawla, Nikhilesh. Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM). United States: N. p., 2016. Web. doi:10.1017/S1431927616011429.
Kaira, Chandrashekara S., Mayer, Carl R., De Andrade, V., De Carlo, Francesco, & Chawla, Nikhilesh. Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM). United States. doi:10.1017/S1431927616011429.
Kaira, Chandrashekara S., Mayer, Carl R., De Andrade, V., De Carlo, Francesco, and Chawla, Nikhilesh. 2016. "Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)". United States. doi:10.1017/S1431927616011429.
@article{osti_1392092,
title = {Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)},
author = {Kaira, Chandrashekara S. and Mayer, Carl R. and De Andrade, V. and De Carlo, Francesco and Chawla, Nikhilesh},
abstractNote = {Abstract Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.},
doi = {10.1017/S1431927616011429},
journal = {Microscopy and Microanalysis},
number = 04,
volume = 22,
place = {United States},
year = 2016,
month = 7
}