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Title: In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.

Abstract

Abstract not provided.

Authors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22)
OSTI Identifier:
1390469
Report Number(s):
SAND2016-8776C
647200
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the The 16th European Microscopy Congress held August 28 - September 2, 2016 in Lyon, France.
Country of Publication:
United States
Language:
English

Citation Formats

Bufford, Daniel Charles, Douglas Stauffer, Mook, William, S.A. Syed Asif, Boyce, Brad Lee, and Hattar, Khalid Mikhiel. In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.. United States: N. p., 2016. Web.
Bufford, Daniel Charles, Douglas Stauffer, Mook, William, S.A. Syed Asif, Boyce, Brad Lee, & Hattar, Khalid Mikhiel. In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.. United States.
Bufford, Daniel Charles, Douglas Stauffer, Mook, William, S.A. Syed Asif, Boyce, Brad Lee, and Hattar, Khalid Mikhiel. Thu . "In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.". United States. doi:. https://www.osti.gov/servlets/purl/1390469.
@article{osti_1390469,
title = {In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.},
author = {Bufford, Daniel Charles and Douglas Stauffer and Mook, William and S.A. Syed Asif and Boyce, Brad Lee and Hattar, Khalid Mikhiel},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Sep 01 00:00:00 EDT 2016},
month = {Thu Sep 01 00:00:00 EDT 2016}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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