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Title: In Situ Fatigue of Cu Thin Films using a nanoDMA modified nanoindentation system.

Conference ·
OSTI ID:1390469

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1390469
Report Number(s):
SAND2016-8776C; 647200
Resource Relation:
Conference: Proposed for presentation at the The 16th European Microscopy Congress held August 28 - September 2, 2016 in Lyon, France.
Country of Publication:
United States
Language:
English