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Title: Fluid-cooled heat sink for use in cooling various devices

Abstract

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Inventors:
; ; ;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1390168
Patent Number(s):
9,759,493
Application Number:
14/626,964
Assignee:
U.S. Department of Energy NREL
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Feb 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, and Narumanchi, Sreekant. Fluid-cooled heat sink for use in cooling various devices. United States: N. p., 2017. Web.
Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, & Narumanchi, Sreekant. Fluid-cooled heat sink for use in cooling various devices. United States.
Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, and Narumanchi, Sreekant. Tue . "Fluid-cooled heat sink for use in cooling various devices". United States. doi:. https://www.osti.gov/servlets/purl/1390168.
@article{osti_1390168,
title = {Fluid-cooled heat sink for use in cooling various devices},
author = {Bharathan, Desikan and Bennion, Kevin and Kelly, Kenneth and Narumanchi, Sreekant},
abstractNote = {The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 12 00:00:00 EDT 2017},
month = {Tue Sep 12 00:00:00 EDT 2017}
}

Patent:

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