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Title: Micro electro-mechanical heater

Abstract

A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.

Inventors:
; ; ;
Publication Date:
Research Org.:
Hysitron, Inc., Eden Prairie, MN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1390064
Patent Number(s):
9,759,641
Application Number:
14/948,549
Assignee:
Hysitron, Inc. CHO
DOE Contract Number:
FG02-07ER84812
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Nov 23
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE

Citation Formats

Oh, Yunje, Asif, Syed Amanulla Syed, Cyrankowski, Edward, and Warren, Oden Lee. Micro electro-mechanical heater. United States: N. p., 2017. Web.
Oh, Yunje, Asif, Syed Amanulla Syed, Cyrankowski, Edward, & Warren, Oden Lee. Micro electro-mechanical heater. United States.
Oh, Yunje, Asif, Syed Amanulla Syed, Cyrankowski, Edward, and Warren, Oden Lee. 2017. "Micro electro-mechanical heater". United States. doi:. https://www.osti.gov/servlets/purl/1390064.
@article{osti_1390064,
title = {Micro electro-mechanical heater},
author = {Oh, Yunje and Asif, Syed Amanulla Syed and Cyrankowski, Edward and Warren, Oden Lee},
abstractNote = {A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2017,
month = 9
}

Patent:

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