skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Methods and devices for fabricating and assembling printable semiconductor elements

Abstract

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Inventors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, Urbana, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1389833
Patent Number(s):
9,761,444
Application Number:
15/084,091
Assignee:
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS CHO
DOE Contract Number:
FG02-91ER45439
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Mar 29
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Nuzzo, Ralph G., Rogers, John A., Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, and Zhu, Zhengtao. Methods and devices for fabricating and assembling printable semiconductor elements. United States: N. p., 2017. Web.
Nuzzo, Ralph G., Rogers, John A., Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, & Zhu, Zhengtao. Methods and devices for fabricating and assembling printable semiconductor elements. United States.
Nuzzo, Ralph G., Rogers, John A., Menard, Etienne, Lee, Keon Jae, Khang, Dahl-Young, Sun, Yugang, Meitl, Matthew, and Zhu, Zhengtao. 2017. "Methods and devices for fabricating and assembling printable semiconductor elements". United States. doi:. https://www.osti.gov/servlets/purl/1389833.
@article{osti_1389833,
title = {Methods and devices for fabricating and assembling printable semiconductor elements},
author = {Nuzzo, Ralph G. and Rogers, John A. and Menard, Etienne and Lee, Keon Jae and Khang, Dahl-Young and Sun, Yugang and Meitl, Matthew and Zhu, Zhengtao},
abstractNote = {The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2017,
month = 9
}

Patent:

Save / Share:
  • The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
  • The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
  • The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
  • The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
  • The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.